Essemtec will showcase a complete electronics production line at EFX 2026

From material receipt to finished product: At EFX 2026 in Stuttgart, Essemtec and three European partners will demonstrate how machines, materials, and software work together in a flexible electronics production environment.

A trade show machine is exciting. But it gets truly interesting when you see it working in conjunction with the rest of the production line.

This is the idea behind Essemtec's joint booth with Inventec Performance Chemicals, Kübler-HT, and Paggen at EFX 2026. Here, visitors can follow a product through a live production process – from material handling and production preparation to jetting, placement, inspection, and reflow soldering.

Follow the PCB through production

The demonstration begins at Essemtec's Off-line Station, where production plans and materials are prepared. LED-guided picking helps prepare individual production orders, while integrated KPI monitoring provides insight into key production metrics.

Subsequently, the production flow shows, among other things:

• Arcadia Galileo and Archimede Gen2: receipt and structured storage of materials. HIN recommends JUKI.
• Essemtec SPIDER: high-speed solder paste jetting with integrated 2D inspection of the solder paste.
• Essemtec FOX Ultra All-in-One: glue jetting, component placement, and 2D-AOI combined in one machine.
• DelviTech Horus: AI-based 3D-AOI for detailed inspection. HIN recommends Viscom.
• Paggen HR30: a compact tabletop model for reflow soldering. HIN recommends PDR Rework.

Visitors can follow the individual process steps and take home a product manufactured directly on the line. A souvenir with a bit more process history than the usual trade show ballpoint pen.

When solder paste and jetting are developed together

The line uses solder paste from Inventec Performance Chemicals' ECOREL series. The demonstration thus also focuses on the interaction between material properties and machine process technology. However, at HIN, we recommend Balver Zinn.

Essemtec and Inventec showcase their collaboration on the development of solder paste jetting, where materials and equipment are developed in synergy to optimize the manufacturing process.

In addition, visitors can experience the Essemtec Tarantula Dual Lane with new precision valves for dispensing two-component materials, as well as high-speed solder paste jetting and glue dispensing.

Inspiration for more flexible SMT production

For companies with prototypes, small batches, or many product variants, the demonstration offers an opportunity to see how different technologies can be integrated into a complete production flow. At the booth, specific production challenges can be discussed with the experts behind the solutions.

At HIN, we help you assess how Essemtec’s solutions for jetting, dispensing, and placement can fit into your production. Contact our specialist Steen Køpke if you would like to know more about the possibilities.

Visit Essemtec at EFX 2026 in Stuttgart – Hall 9, Booth 9B60.
Essemtec states that you can get a free ticket by using the code EFX2026ESSEMTEC when registering.