SAVE up to 70% on energy with vapor phase soldering!
Electronics production without electricity – unthinkable! The largest consumers of electricity in SMT production are the reflow soldering systems. However, this soldering process is used in many electronics production plants worldwide and is a very energy-inefficient method of soldering.
Energy saving through vapor phase soldering!
Vapor phase soldering enables more than 20 times better heat transfer than air due to the energy transfer with steam. This also means a saving in power consumption of up to 70% when using an ASSCON vapor phase soldering system. Find out more about the advantages of vapor phase soldering!
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VP800 VAPOR PHASE
Vapour-Phase soldering system. For laboratories, prototypes and prefabrications.
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VP800 VACUUM
Vapour-Phase Vacuum Soldering
System for laboratories, prototyping and pre-series production -
VP810VAC BATCH
Vapour-phase vacuum soldering machine – Vacuum system for mass production
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VP2100 with Vacuum Option
Vapour-Phase Vacuum soldering machine for soldering power components.
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VP2200-100 with Vacuum option
A high-performance inline Vapour Phase system developed for automated series production. With the optional Vacuum option and ASSCON's patented Multi Vacuum technology, voids in solder joints can be reduced to less than 1%, making the solution particularly suitable for high-power electronics and other applications with high quality requirements.
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The system is integrated directly into automatic SMT lines and operates without workpiece carriers, ensuring high capacity and fast product changes. The electrically adjustable transport and center support make it easy to handle various PCB formats, while the vacuum module can be retrofitted as needed. The result is a flexible inline solution with high uptime, uniform soldering quality, and maximum throughput capacity.
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VP6100 Vacuum
A stand-alone Vapour Phase system developed for production with high demands on solder quality. The patented Multi Vacuum technology effectively reduces voids in solder joints and makes it possible to achieve void levels below 1%, which is an advantage in power electronics and other critical applications, among others.
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The vacuum module can be activated during the soldering process and is located outside the soldering zone (Clean Vacuum Technology). This minimizes maintenance and contributes to stable and reliable production.
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The VP6100 Vacuum handles PCBs up to 600 × 600 mm with a maximum component height of 60 mm and combines high process stability with an average energy consumption of only 3.7 kWh.
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ASSCON VP1100
A stand-alone Vapour Phase system developed for both small and large production runs. The flexible workpiece carriers make it quick to adapt the system to different PCBs and product types, making the VP1100 suitable for companies with varying production tasks and high demands for process stability.
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The system handles PCBs with a soldering format of up to 610 × 610 mm and a maximum component height of 60 mm. With an average energy consumption of only 3.3 kWh, the VP1100 combines high capacity with energy-efficient operation. The result is a stable and uniform soldering process, suitable for both prototype production and series production.
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Desoldering unit
ASSCON's de-soldering units are specially developed fixtures that support safe and controlled de-soldering of components in the Vapour Phase system process. The carriers stabilize the PCB during heating, protect sensitive components, and contribute to consistent results during rework and repair. The solution is adapted to the individual application and can be used with ASSCON's Vapour Phase systems.
Steen Koepke