The 3D AOI system is designed for precise inspection of THT solder joints and components on the bottom side of printed circuit boards. Developed for inline operation, the system ensures reliable control of solder joints, pin formations, and through-holes in demanding electronics production. With advanced 3D measurement technology and high inspection speed, the iS6059 supports stable process control, traceability, and documentation. This solution is ideal for manufacturers using selective soldering or wave soldering who demand high quality and reproducibility – even on the bottom side of the PCB.

3D AOI system developed for automatic inspection of THT solder joints and through-hole components in electronics production. The system is designed for precise control of solder fill, pin position, and solder quality after wave or selective soldering. With advanced 3D measurement technology and powerful image processing, the iS6052 THT ensures reliable defect detection and stable, reproducible process control. The solution can be integrated inline and supports high throughput as well as full traceability, making it suitable for productions with high quality and documentation requirements.