Tin-wire SN100CS® – SnCu0,7Ni0,05Ge0,025 3.0 mm
SN100CS® from Balver Zinn is a further development of the recognized SN100C® alloy and has been developed for professional soldering processes where high process stability, low oxidation, and consistent solder quality are crucial. The alloy combines tin, copper, nickel, and germanium to create a lead-free soldering solution with proven benefits in electronics manufacturing, rework, and industrial soldering.
The increased germanium content helps reduce oxidation during the soldering process, contributing to lower material consumption, less dross formation, and a more stable process over time. The result is excellent solder joints and high quality in the finished production.
Further development of the well-known SN100C® technology
SN100CS® is based on the proven SN100C® alloy, which has been among the preferred lead-free solder alloys in the electronics industry for many years. With the addition of nickel and an increased germanium content, a more stable alloy is achieved, which is particularly suitable for demanding production environments.
The alloy is developed for companies that want a lead-free alternative with high operational reliability and consistent results.
Suitable for soldering larger items and connections
The strong 3.0 mm wire diameter makes the product particularly suitable for applications where larger quantities of solder need to be applied quickly and controllably.
Typical applications include:
• Soldering of larger circuit boards and components
• Cable and wire connections
• Power-carrying connections
• Repair and maintenance of electronics
• Industrial electronics
• Electrical and energy applications
• Prototypes and special production
The larger diameter makes it possible to work efficiently on solder points with high thermal mass, where thinner solder wire would often be less effective.
Reduces oxidation and dross formation
SN100CS® has been developed with a focus on minimizing oxidation during the soldering process. The germanium content helps reduce the formation of oxides, while the alloy's composition supports stable soldering properties and excellent soldering results.
Benefits include:
• Reduced oxidation
• Lower dross formation
• Reduced risk of solder bridges
• Improved through-hole fill
• Excellent and shiny solder joints
• High process stability
Advantages of SN100CS®
• Lead-free solder alloy
• Based on the well-known SN100C® technology
• Increased germanium content reduces oxidation
• Low dross formation
• Reduces the risk of solder bridges
• Improved through-hole fill
• Excellent and consistent solder joints
• Suitable for electronics production and maintenance
• High process stability
• RoHS compliant
Technical specifications
Manufacturer: Balver Zinn
Product name: SN100CS®
Product type: Lead-free solid solder wire
Alloy type: SN100CS®
Composition: SnCu0,7Ni0,05Ge0,025
Wire diameter: 3.0 mm
Lead-free: Yes
Copper content: 0.6-0.7 %
Nickel content: 0.04-0.06 %
Germanium content: 0.02-0.03 %
Liquid form: 227 °C
Solid form: 227 °C
Recommended working temperature: 260-320 °C
ANSI/J-STD-006C: Compliant
DIN EN ISO 9453: Alloy 403
RoHS compliant: Yes