Product Overview
This cleaning agent from KYZEN, AQUANOX A4727, is a water-based electronic assembly cleaning solution for printed circuit boards and advanced packaging assemblies. AQUANOX A4727 is designed for the removal of solder paste and flux residues and is highlighted as effective against both Pb-free and no-clean flux formulations.
Technical profile
AQUANOX A4727 is laboratory and field-tested in spray-in-air processes. The manufacturer's product information specifies typical process parameters and essential product data, which provide guidelines for application and process control.
- Type: water-based electronic assembly cleaning solution (manufacturer specification).
- Tested process: spray-in-air (lab- and field-tested).
- Compatibility: stated as compatible with a wide range of components, coatings, labels, and equipment (manufacturer specification).
Typical applications
AQUANOX A4727 is used for cleaning printed circuit boards and advanced packaging assemblies. The product is stated to be effective for the removal of solder flux residues, including Pb-free and no-clean formulations, in spray-in-air processes.
Process recommendations (specified by manufacturer)
- Typical concentration: 10–15%.
- Typical temperature: 140°F (60°C).
- Cleaning step: rinsing with deionized (DI) water.
- Drying: recommended with forced/hot air drying.
Specifications
- Product name: AQUANOX A4727.
- Manufacturer: KYZEN.
- Manufacturer part number: E01772.
- pH (10 g/L): 9.6.
- Flash point: >210°F (>99°C).
- Boiling point: 282°F (139°C).
- VOC at 10%: 82.4 g/L (specified as VOC at 10%).
- Environmental/safety declarations from manufacturer: specified as non-hazardous, biodegradable, CFC-free, and HAP-free.
- Process specifications: concentration 10–15%, temperature 140°F (60°C), rinse with DI-water, drying with forced/hot air.
References: Manufacturer's product information for AQUANOX A4727 (KYZEN).
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