Solder Paste JEAN-151 SAC305 T4 – Sn96.5Ag3.0Cu0.7 500g

JEAN-151 SAC305 T4 is a premium lead-free solder paste from Balver Zinn COBAR®, developed for modern SMT production with a focus on high print quality, process stability, and reliable solder joints. The combination of the well-documented SAC387 alloy and the advanced JEAN-151 No-Clean flux system makes the product suitable for both standard industrial electronics and demanding high-reliability applications.

The Type 4 powder ensures precise paste deposition and excellent printing results for fine pitch components, QFNs, BGAs, and other modern SMT designs.

SAC387 – Lead-free Solder Alloy for Demanding Electronics

JEAN-151 SAC305 T4 is based on the SAC387 alloy (Sn95.5Ag3.8Cu0.7), which is known for its excellent mechanical properties, high reliability, and stable soldering characteristics.

The advantages include:

• High mechanical strength
• Excellent soldering properties
• Proven reliability
• Suitable for automotive electronics
• High thermal stability
• Long lifespan of solder joints

The alloy is widely used in industry, medical, automotive, and other electronics where quality and traceability are crucial.

JEAN-151 No-Clean Flux System

JEAN-151 is Balver Zinn's premium flux technology developed for modern SMT production.

The flux system offers:

• Halogen-free formulation
• ROL0 classification according to IPC J-STD-004
• No-Clean process
• Excellent wetting properties
• High temperature stability
• Colorless flux residues
• Stable printing process throughout long production runs

This contributes to a robust and reproducible production process with minimal risk of soldering defects.

Type 4 Solder Powder for Fine Pitch Components

The Type 4 powder with a particle size of 20-38 µm is developed for modern printed circuit boards with high component density.

Suitable for:

• Fine pitch components
• QFN components
• BGA components
• SMT assembly
• Industrial electronics
• Automotive electronics
• Medical electronics
• High-reliability production

The fine powder structure provides high print quality and uniform paste deposition.

Suitable for Multiple Reflow Processes

JEAN-151 SAC305 T4 is developed for flexible use in modern production environments.

The product supports:

• Reflow in atmospheric air
• Reflow in nitrogen
• Vapor Phase processes
• Standard SMT production
• High-volume production

The solder paste works effectively on common surface finishes such as ENIG, HASL, OSP, and Immersion Tin.

Ideal for Industrial Electronics and Automotive

The product is developed for:

• Consumer electronics
• Standard industrial electronics
• Automotive electronics
• Hi-Rel electronics
• Telecommunications
• Industrial automation
• Measurement and test equipment

The high process stability makes the paste suitable for companies focused on quality assurance and reproducible production results.

Advantages of JEAN-151 SAC305 T4

• Lead-free SAC387 alloy
• JEAN-151 No-Clean flux system
• Halogen-free ROL0 flux
• Type 4 solder powder
• High print quality
• Excellent wetting properties
• Colorless flux residues
• Suitable for fine pitch components
• High process stability
• RoHS compliant

Technical Specifications

Manufacturer: Balver Zinn COBAR®
Product name: JEAN-151 SAC305 T4
Product type: Lead-free solder paste
Alloy: SAC387
Composition: Sn95.5Ag3.8Cu0.7
Flux system: JEAN-151
Flux classification: ROL0
Powder type: Type 4 (20-38 µm)
Flux content: 11.3 %
Content: 500 g
Liquid form: 219 °C
Solid form: 217 °C
Recommended peak temperature: 232-260 °C
Color of flux residues: Colorless
Application: SMT stencil printing and reflow soldering
RoHS compliant: Yes
Shelf life: 12 months with proper storage