Solder Paste LF NC SN100C® T3 – SnCu0.7NiGe 500 g
LF NC SN100C® T3 is a professional lead-free solder paste from Balver Zinn COBAR®, developed for SMT production with a focus on high process stability, consistent soldering results, and low material costs. The solder paste combines the well-known SN100C® alloy with the JEAN-151 flux system and Type 3 solder powder, providing excellent print quality and reliable solder joints in modern electronics production.
The product is particularly suitable for industrial electronics, automotive, energy technology, telecommunications, and other applications where a robust and economical lead-free soldering process is desired.
SN100C® – a proven silver-free solder alloy
SN100C® is a micro-alloyed lead-free solder alloy based on tin, copper, nickel, and germanium (Sn99.3Cu0.7NiGe). The alloy is known for its high process stability and is used today by electronics manufacturers worldwide as an attractive alternative to traditional silver-containing alloys.
The advantages of SN100C® include:
• Silver-free alloy with low material costs
• Reduced oxidation during the soldering process
• Beautiful and shiny solder joints
• Stable soldering process
• High reproducibility
• Documented reliability
Compared to SAC305, SN100C® can often reduce alloy costs by 30-40%, while maintaining solder quality.
JEAN-151 flux system with ROL0 classification
JEAN-151 is developed for modern SMT processes where high print quality and process stability are crucial.
The flux system offers:
• Halogen-free ROL0-classified flux
• No-Clean process
• Improved wetting properties
• Particle-free flux carrier
• High temperature stability
• Long stencil life
• Minimal change in printing properties over time
The flux system is based on selected resins and high-boiling solvents, which contribute to a stable production process even with long production runs.
Type 3 solder powder for standard and advanced SMT production
The Type 3 powder provides an optimal balance between print quality, process window, and production economics.
The solder paste is suitable for:
• SMT assembly
• Standard print designs
• Fine pitch components
• QFN components
• Industrial electronics
• Automotive electronics
• Series production
• High-volume production
Type 3 is among the most commonly used powder types in the electronics industry and supports stable stencil printing processes.
Suitable for air, nitrogen, and vapor phase processes
LF NC SN100C® T3 can be used in a wide range of reflow processes:
• Reflow in atmospheric air
• Reflow in nitrogen
• Vapor Phase processes
• Convection ovens
• High-volume SMT production
The paste provides consistent solder joints on common surface finishes such as ENIG, HASL, OSP, and Immersion Tin.
High process stability and excellent solder appearance
SN100C® is known for producing shiny solder joints and a stable soldering process with a low risk of process variations.
This contributes to:
• High print quality
• Beautiful solder joints
• Low risk of soldering defects
• Consistent production
• High reproducibility
• Stable operation over long production runs
Advantages of LF NC SN100C® T3
• Lead-free SN100C® alloy
• Silver-free SnCu0.7NiGe composition
• JEAN-151 No-Clean flux system
• Halogen-free ROL0 flux
• Type 3 solder powder
• Reduced oxidation
• Beautiful and shiny solder joints
• Suitable for SMT production
• Cost-effective alternative to SAC305
• RoHS compliant
Technical specifications
Manufacturer: Balver Zinn COBAR®
Product name: LF NC SN100C® T3
Product type: Lead-free solder paste
Alloy: SN100C®
Composition: Sn99.3Cu0.7NiGe
Flux system: JEAN-151
Flux classification: ROL0
Powder type: Type 3 (25-45 µm)
Content: 500 g
Lead-free: Yes
Melting point: 227 °C
Application: SMT stencil printing and reflow soldering
Process: Air, nitrogen, and vapor phase
Color of residues: Colorless
RoHS compliant: Yes