Solder Paste LF NC SN100C® T4 – SnCu0.7NiGe 500 g
LF NC SN100C® T4 is a professional lead-free solder paste from Balver Zinn COBAR®, developed for modern SMT production where companies seek high process stability, low material costs, and reliable solder joints. The solder paste combines the silver-free SN100C® alloy with the advanced JEAN-151 flux system and Type 4 solder powder, providing excellent printing results and stable reflow processes.
The product is particularly suitable for electronics manufacturing in industries such as industrial, automotive, energy technology, and other applications where high quality and cost-effectiveness are crucial.
SN100C® – A Proven Silver-Free Solder Alloy
SN100C® is a micro-alloyed lead-free solder alloy based on tin, copper, nickel, and germanium (Sn99.3Cu0.7NiGe). The alloy is known for its high process stability and is used globally as a cost-effective alternative to silver-containing alloys like SAC305.
The micro-alloyed composition contributes to:
• Reduced oxidation
• Beautiful and shiny solder joints
• High process stability
• Lower material costs
• Documented operational reliability
Compared to SAC305, SN100C® can typically reduce alloy costs by 30-40% without compromising solder quality.
JEAN-151 Flux System with ROL0 Classification
The solder paste is based on the JEAN-151 flux system, which is developed for modern SMT processes with a focus on print stability, wetting, and reproducibility.
The benefits include:
• Halogen-free ROL0-classified flux
• No-Clean process
• Improved wetting properties
• Particle-free flux carrier
• High temperature stability
• Minimal change in printing properties over time
The flux system is developed with high-boiling solvents and selected resin blends, contributing to a robust production process.
Type 4 Solder Powder for Fine Pitch Components
The Type 4 powder, with a particle size of 20-38 µm, provides high print quality and makes the paste suitable for modern electronics with small components and fine structures.
Typically used for:
• Fine pitch components
• QFN components
• SMT assembly
• Industrial electronics
• Automotive electronics
• Prototypes and series production
• High-tech electronics
The fine powder structure supports precise stencil printing and uniform paste deposition.
Suitable for Air, Nitrogen, and Vapor Phase Processes
LF NC SN100C® T4 is developed for flexible use in modern reflow processes.
The product works effectively with:
• Reflow in atmospheric air
• Reflow in nitrogen
• Vapor phase processes
• Standard SMT production
• High-volume production
The solder paste provides beautiful solder joints on common surface finishes such as ENIG, HASL, OSP, and Immersion Tin.
High Process Stability and Long Print Life
The JEAN-151 flux system is designed to retain its printing properties over long production runs. This contributes to:
• Stable stencil printing process
• High reproducibility
• Reduced risk of printing defects
• Consistent soldering results
• High productivity in production
This makes the product attractive for companies with continuous SMT production and high quality demands.
Advantages of LF NC SN100C® T4
• Lead-free SN100C® alloy
• Silver-free SnCu0.7NiGe composition
• JEAN-151 No-Clean flux system
• Halogen-free ROL0 flux
• Type 4 solder powder
• Beautiful and shiny solder joints
• Reduced oxidation
• Suitable for fine pitch components
• Cost-effective alternative to SAC305
• RoHS compliant
Technical Specifications
Manufacturer: Balver Zinn COBAR®
Product Name: LF NC SN100C® T4
Product Type: Lead-free solder paste
Alloy: SN100C®
Composition: Sn99.3Cu0.7NiGe
Flux System: JEAN-151
Flux Classification: ROL0
Powder Type: Type 4 (20-38 µm)
Flux Content: 11.3%
Content: 500 g
Melting Point: 227 °C
Recommended Peak Temperature: 238-260 °C
Application: SMT stencil printing and reflow soldering
Process: Air, nitrogen, and vapor phase
Residue Color: Colorless
RoHS Compliant: Yes