BALVER OT2-SN100C-T4 solder paste
BALVER OT2-SN100C-T4 is a lead-free solder paste for professional electronics production. It is developed as a no-clean paste, allowing it to be used in the process without subsequent cleaning when used correctly in the intended process. At the same time, it is halogen and halide-free, which is relevant in environments with requirements for cleanliness and process control.
The paste is specified for the SN100C® alloy, i.e., Sn99.3Cu0.7NiGe, and is supplied in grain size T4 with a particle size of 20–38 µm. This makes it suitable for fine-pitch applications where precise control of dispensing and printing is required. In the datasheet, it is also described as suitable for standard electronics, industrial electronics, and hi-rel electronics, including automotive.
In practice, this means that OT2-SN100C-T4 is a solder paste chosen when working with lead-free assemblies and wanting a process adapted to modern electronic assembly. The recommended top-peak temperature is around 238–260 °C, and it is classified according to DIN-EN-29454-1 (1.1.3.C) and IPC-J-STD-004-A (ROL0).
The packaging is a 500 g PP jar, and the recommended storage temperature is 4–10 °C with a shelf life of 12 months. This is worth keeping track of in production, as the properties of the solder paste depend on proper handling and storage.
Typical applications
- Electronics production with lead-free soldering
- Fine-pitch assembly
- Standard electronics
- Industrial electronics
- Hi-rel electronics, including automotive
Specifications
- Manufacturer: BALVER
- MPN: 2052960500
- Product: OT2-SN100C-T4
- Alloy: SN100C® (Sn99.3Cu0.7NiGe)
- Type: Lead-free, halogen and halide-free no-clean solder paste
- Particle size: T4, 20–38 µm
- Recommended peak reflow temperature: 238–260 °C
- Classification: DIN-EN-29454-1 (1.1.3.C)
- Classification: IPC-J-STD-004-A (ROL0)
- Packaging: 500 g PP jar
- Storage: 4–10 °C
- Shelf life: 12 months
- GTIN/EAN: Not provided
- See datasheet from manufacturer
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