Solder Paste NC HS DIS SnPb37 T4 – Sn63Pb37 500 g
NC HS DIS SnPb37 T4 is a professional lead-containing solder paste developed for SMT production, rework, and electronics manufacturing, where high demands are placed on print quality, soldering properties, and process stability. The combination of the eutectic Sn63Pb37 alloy and a modern No-Clean flux system provides rapid reflow, excellent wetting, and uniform solder joints with high reproducibility.
The fine Type 4 powder classification makes the solder paste particularly suitable for modern PCB designs with small pad geometries, fine-pitch components, and advanced SMT applications.
Sn63Pb37 – the classic standard in electronics soldering
Sn63Pb37 is a eutectic solder alloy consisting of 63% tin and 37% lead. The alloy has a precise melting point of 183 °C, meaning it transitions directly from solid to liquid form without a plastic transition range.
This offers several advantages:
• Fast and controlled solidification
• Low risk of cold solder joints
• Excellent wetting properties
• High process stability
• Beautiful solder joints
• Proven reliability
Therefore, Sn63Pb37 continues to be widely used in production, service, and rework where lead-containing processes are permitted.
Type 4 solder powder for fine-pitch applications
Type 4 powder has a fine particle size, making the paste suitable for precision printing and components with small solder pads.
Typically used for:
• SMT assembly
• Fine-pitch components
• QFN components
• BGA components
• Rework and repair
• Prototype production
• Industrial electronics
• High-reliability electronics
The fine powder structure ensures uniform stencil printing and high reproducibility in production.
No-Clean flux for efficient production
The flux system is developed to support modern SMT processes with a focus on quality and efficiency.
Benefits include:
• No-Clean technology
• Low flux residue
• Effective activation during reflow
• Stable printing process
• Good wetting properties
• High process robustness
In many applications, subsequent cleaning can be reduced or completely avoided.
Suitable for reflow and rework
NC HS DIS SnPb37 T4 can be used for:
• SMT production
• Reflow soldering
• Rework and repair
• Service production
• Prototype assembly
• Industrial electronics
• Telecommunications
• Measurement and test equipment
The eutectic alloy makes the product particularly suitable for processes where precision and process control are crucial.
High quality and uniform soldering results
The proven Sn63Pb37 alloy combined with a modern flux system provides:
• Uniform solder joints
• High mechanical strength
• Appealing solder appearance
• Good wetting
• High process stability
• Proven quality through many years of use in the electronics industry
Advantages of NC HS DIS SnPb37 T4
• Sn63Pb37 eutectic solder alloy
• Type 4 solder powder
• No-Clean flux system
• Excellent wetting properties
• High print quality
• Suitable for fine-pitch components
• Stable SMT process
• Ideal for rework and repair
• Uniform soldering results
• Long proven reliability
Technical specifications
Manufacturer: Balver Zinn COBAR®
Product name: NC HS DIS SnPb37 T4
Product type: Solder paste
Alloy: Sn63Pb37
Composition: 63% tin / 37% lead
Powder type: Type 4 (T4)
Content: 500 g
Melting point: 183 °C
Recommended process temperature: Depending on process profile
Application: SMT stencil printing and reflow soldering
Suitable for: SMT, rework and prototype production
Packaging: 500 g jar
Shelf life: See applicable datasheet
RoHS compliant: No (lead-containing alloy)