BALVER OT2-SAC3-T3 solder paste
BALVER OT2-SAC3-T3 is a no-clean solder paste for reflow soldering. It is classified as ROL0 and is halogen- and halide-free, making it intended for processes where efficient soldering is required without subsequent cleaning of flux residues. The paste is compatible with lead-free alloys, and the specified standard alloy is SAC305, i.e., Sn96.5Ag3Cu0.5.
In practice, this is a solder paste for electronics manufacturing involving stencil printing and subsequent reflow. Balver indicates a recommended print speed of up to 250 mm/s, and the product is developed with a focus on reducing typical oxidation defects such as graping and head-in-pillow.
The paste is supplied in a 500 g PP jar. The T3 variant indicates a particle size of 25–45 µm, which is relevant to know when the paste must match the chosen process and print task. Storage is recommended at 4–10 °C, and the shelf life is 12 months under those conditions.
Typical applications
OT2-SAC3-T3 is relevant in standard electronics and industrial electronics. According to the manufacturer's classification, it is also indicated for hi-rel electronics, including automotive.
For many production facilities, it is particularly interesting that the paste is no-clean. This means that one can work with a cleaner process and, in many cases, avoid a separate cleaning step after soldering.
Specifications
- Manufacturer: BALVER
- MPN: 2050640500
- Product name: OT2-SAC3-T3
- Type: No-clean solder paste for reflow soldering
- Classification: ROL0
- Halogen-free: Yes
- Halide-free: Yes
- Compatible alloy: Lead-free alloys
- Standard alloy: SAC305 / SAC3 / Sn96.5Ag3Cu0.5
- Particle size: 25–45 µm (T3)
- Recommended print speed: up to 250 mm/s
- Packaging: 500 g PP jar
- Storage: 4–10 °C
- Shelf life: 12 months
- DIN-EN-29454-1:1994: 1.1.3.C
- IPC-J-STD-004-A:2004: ROL0
- See datasheet from the manufacturer
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