Solder Paste OT2M X512V SAC305 T3 500 g
OT2M X512V SAC305 T3 is a professional lead-free solder paste developed for modern SMT production, where high demands are placed on print quality, process stability, and solder reliability. The solder paste combines the SAC305 alloy with the COBAR® JEAN-151 flux system and Type 3 solder powder, making it suitable for a wide range of electronics applications in industry, medical, automotive, and advanced electronics manufacturing.
The halogen-free ROL0 flux ensures effective wetting, stable printing processes, and uniform solder joints with high mechanical strength. At the same time, the paste supports modern reflow processes in atmospheric air, nitrogen, and vapor phase.
SAC305 – the industry standard for lead-free SMT soldering
SAC305 consists of tin, silver, and copper (Sn96.5Ag3.0Cu0.5) and is one of the most widely used lead-free solder alloys in the electronics industry. The alloy is known for its high reliability, good mechanical strength, and proven performance in demanding electronics environments.
SAC305 is widely used in:
• Electronics manufacturing
• Automotive electronics
• Medical and life science
• Industrial electronics
• Telecommunications
• High-reliability electronics
The low risk of solder defects and stable soldering properties make SAC305 a safe choice for companies with high quality requirements.
JEAN-151 flux system for stable printing process
COBAR® JEAN-151 has been developed to provide a robust and stable stencil printing process. The flux system is based on a combination of high- and low-melting resins and high-boiling solvents, which contribute to improved temperature stability and uniform print quality.
Benefits include:
• Halogen-free ROL0 flux
• Improved wetting properties
• Stable printing process
• Low risk of printing defects
• High reproducibility
• Minimal change in printing properties over time
The flux system is developed for modern SMT production with a focus on quality, process stability, and high yield.
Suitable for high-speed printing and fine structures
OT2M X512V SAC305 T3 is developed for stencil printing in modern SMT lines and delivers stable results in both standard and high-speed production.
The product is suitable for:
• SMT production
• Fine pitch components
• QFN components
• BGA components
• Automotive electronics
• Medical electronics
• Industrial electronics
• High-volume production
The Type 3 powder provides a good balance between print quality, process window, and cost-effectiveness.
High process stability during reflow
The solder paste is designed to deliver consistent results in various reflow processes:
• Reflow in atmospheric air
• Reflow in nitrogen
• Vapor phase processes
• Standard SMT production
• High-reliability electronics
The good wetting properties contribute to reliable solder joints and high product quality.
Advantages of OT2M X512V SAC305 T3
• Lead-free SAC305 alloy
• COBAR® JEAN-151 flux system
• Halogen-free ROL0 flux
• Type 3 solder powder
• Suitable for SMT production
• Good wetting properties
• High print quality
• Stable stencil printing process
• Suitable for reflow in air, nitrogen, and vapor phase
• RoHS compliant
Technical specifications
Manufacturer: Balver Zinn / COBAR®
Product name: OT2M X512V SAC305 T3
Product type: Lead-free solder paste
Alloy: SAC305
Composition: Sn96.5Ag3.0Cu0.5
Flux system: JEAN-151
Flux classification: ROL0
Powder type: Type 3 (T3)
Content: 500 g
Lead-free: Yes
Melting range: 217-220 °C
Application: SMT stencil printing and reflow soldering
Suitable for: Air, nitrogen, and vapor phase
RoHS compliant: Yes