KYZEN E5325 – Cleaning Agent for Solder Pallets and Process Equipment
KYZEN E5325 is a water-soluble cleaning agent for off-line cleaning of solder pallets, process tools, and production equipment in electronics manufacturing. It is developed for the efficient removal of even stubborn flux and solder paste residues from, among other things, solder pallets, wave soldering fingers, reflow oven parts, and associated process tools.
The low odor and relatively short contact time make E5325 suitable for routine maintenance where effective cleaning must be combined with minimal downtime for production equipment.
Cleaning of Solder Pallets, Reflow and Wave Soldering Equipment
During the soldering process, flux and solder paste can build up on pallets, tools, and machine parts. E5325 is developed to remove these process residues and can be used for the maintenance of both reflow and wave soldering equipment.
The cleaning agent is compatible with aluminum, copper, and steel, as well as standard materials used in reflow ovens, wave soldering machines, and associated process tools.
For Spray-in-Air, Immersion, and Ultrasonic Cleaning
KYZEN E5325 can be used in various automated and off-line cleaning processes. Spray-in-air is a primary application, but the manufacturer also specifies E5325 for immersion and ultrasonic systems.
Typical Process Data:
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Application: Solder pallets, process tools, and maintenance cleaning
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Cleaning processes: Spray-in-air, immersion, and ultrasonic
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Concentration: 10–30%
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Process temperature: Ambient to 60 °C
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Rinsing: Optional – DI water
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Drying: Warm air
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pH at 10 g/l: 11
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Water solubility: Complete
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Flash point: None up to boiling point
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Boiling point: 103 °C
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VOC at 10%: 0.0 g/l
Optimal process parameters depend on the equipment, process residues, and the specific cleaning process.
Advantages of KYZEN E5325
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Removes stubborn flux and solder paste residues
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Suitable for cleaning solder pallets and process tools
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Can be used for parts from reflow ovens and wave soldering machines
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For spray-in-air, immersion, and ultrasonic cleaning
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Compatible with aluminum, copper, and steel
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Low odor
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Short contact time
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Completely water-soluble
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No VOC at 10% concentration
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Developed to reduce time spent on maintenance and cleaning
What is KYZEN E5325 used for?
KYZEN E5325 is used for off-line cleaning of solder pallets, process tools, and machine parts in electronics manufacturing. The cleaning agent removes flux and solder paste residues from, among other things, pallets, wave soldering fingers, and reflow oven parts. It can be used in spray-in-air, immersion, and ultrasonic systems.