KYZEN CYBERSOLV C8882 – Cleaning of stencils, squeegees, and misprinted PCBs
KYZEN CYBERSOLV C8882 is a fast-acting solvent-based cleaning agent developed for cleaning stencils, squeegees, misprinted PCBs, and understencil cleaning systems in SMT production. The product effectively dissolves solder paste, uncured SMT adhesives, and flux residues, leaving the surface clean and residue-free.
In modern electronics manufacturing, stencil cleaning is a crucial factor for print quality. Accumulation of solder paste and flux in stencil apertures can lead to uneven prints, insufficient paste deposition, and an increased risk of solder defects. CYBERSOLV C8882 is designed to quickly and effectively remove these residues and contribute to a stable and reproducible printing process.
Effective cleaning of stencils and understencil systems
CYBERSOLV C8882 is specially formulated for use in automatic understencil wipe systems as well as manual cleaning processes. The product instantly dissolves all common flux types found in solder paste, including:
- Water-soluble fluxes
- Rosin-based fluxes
- No-clean fluxes
- Low-residue flux systems
- Lead-free solder pastes
Its rapid dissolving power ensures clean stencil apertures and more consistent solder paste prints from board to board.
Ideal for misprinted PCBs and squeegees
In addition to stencil cleaning, CYBERSOLV C8882 is suitable for cleaning:
- Misprinted PCBs
- Squeegees
- Stencil tools
- Printer components
- Manual cleaning tasks
- Handheld ultrasonic systems
The product dries quickly without leaving residues, which reduces waiting time and contributes to more efficient production.
Compatible with modern stencil technology
Many modern stencils are equipped with nano-coating to improve solder paste release. CYBERSOLV C8882 is formulated not to attack or remove these coatings.
The product is also documented to be compatible with the fluid-affected components in automatic stencil printers and understencil cleaning systems.
Benefits of KYZEN CYBERSOLV C8882
- Effective cleaning of stencils, squeegees, and misprinted PCBs
- Removes all common flux types
- Dissolves solder paste and uncured SMT adhesives
- Suitable for understencil wipe processes
- Fast-drying formulation
- Leaves no residue
- Compatible with nano-coated stencils
- Suitable for manual and automatic processes
- No rinsing required
- Low odor and easy handling
Recommended process parameters
- Process: Understencil wipe, manual cleaning, and handheld ultrasound
- Concentration: 100%
- Temperature: Ambient temperature
- Rinsing: Not required
- Drying: Not required
Specifications
Manufacturer: KYZEN
Product name: CYBERSOLV C8882
Product type: Solvent-based stencil cleaner
Application: Cleaning of stencils, squeegees, and misprinted PCBs
Cleaning methods: Understencil wipe, manual cleaning, and handheld ultrasound
Concentration: 100%
VOC content: 875.6 g/L
Boiling point: 132 °C
Flash point: 61 °C
Water solubility: Partial
RoHS compliant: Yes
Halogen-free: Yes