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    Cleaning fluid CYBERSOLV C8882 for stencil washing 5 liters

    Cleaning fluid CYBERSOLV C8882 for stencil washing 5 liters

    Kyzen

    C8882-5

    In stock

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    Product Overview

    CYBERSOLV C8882 is a solvent-based stencil cleaning agent from KYZEN designed for the removal of solder paste, uncured SMT adhesive, and flux residues. The product is described as fast-acting on flux components, having a mild solvent odor, and drying quickly without leaving residues. CYBERSOLV C8882 is stated not to adversely affect nano-coated stencils and is compatible with the wetted components of automatic understencil wipe systems.

    Product Details

    Function and Use

    • Dissolves solder paste, uncured SMT adhesive, and flux residues.
    • Can be used in automated understencil wipe processes, hand wiping, ultrasonic cleaners, and spray systems designed for solvents.
    • Mild odor and rapid dissolution of flux components without known negative effect on nano-coatings.

    Typical Applications

    • Cleaning of stencils for solder paste and flux residues.
    • Removal of incorrectly printed solder paste from mis-printed PCBs (as indicated on the manufacturer's product page).
    • Cleaning of stencil tools and printing squeegees.
    • Application in understencil wipe processes — both automatic and manual — as well as in ultrasonic and spray systems suitable for solvents.

    Process Parameters (as specified by the manufacturer)

    • Recommended concentration: 100% (undiluted concentrate).
    • Temperature: Ambient.
    • Rinsing: Optional.
    • Drying: Air.

    Sources

    Specifications

    • Product name: CYBERSOLV C8882.
    • Manufacturer: KYZEN.
    • Flash point: 142 °F (61 °C).
    • Boiling point: 270 °F (132 °C).
    • VOC (@100%): 875.6 g/L.
    • Water solubility: Partial.
    • pH (10 g/L): Not applicable (solvent-based).
    • Processes used: Understencil, handheld, ultrasonic cleaner, manual.
    • Concentration in use: 100% (as stated by the manufacturer).
    • Product characteristics: Mild solvent odor; rapid dissolution of flux components; leaves no residue according to the manufacturer; stated compatible with nano-coated stencils and with wetted components in understencil wipe systems.

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