Product Overview
MICRONOX MX2322 is a semiconductor-grade, semi-aqueous solvent from KYZEN intended for paste flux cleaning. The product is formulated for cleaning paste flux used in advanced packaging and wafer processes and is supplied for use as received. MICRONOX MX2322 rinses quickly and effectively with deionized (DI) water.Technical Characteristics
- Broad process window and long bath life (as specified by the manufacturer).
- Compatibility with sensitive metals and passivation materials, including aluminum, copper, and nickel (as specified by the manufacturer).
- Cleaning properties documented for single-wafer spray-in-air tools and immersion systems (as specified by the manufacturer).
Typical Applications
- Cleaning of paste flux in wafer bumping.
- Cleaning in wafer-level packaging (WLP) processes.
- Cleaning in die-attach processes.
- Cleaning in flip chip processes.
- Cleaning in SiP applications containing copper pillar.
Documentation
Product information and recommended process parameters are provided by KYZEN on the manufacturer's product page: KYZEN Product Page for MICRONOX MX2322.
Specifications
- Product Name: MICRONOX MX2322.
- Manufacturer: KYZEN. (MPN: E01767)
- Application: Cleaning of paste flux for wafer bumping, wafer-level packaging, die-attach, flip chip, and SiP with copper pillar.
- Typical Process Parameters (manufacturer's recommendation): immersion systems, 100% concentration, 145°F (63°C), DI water rinse, hot air drying.
- Flash point: 208°F (98°C).
- Boiling point: 343°F (173°C).
- Water solubility: Partial water solubility (as specified by the manufacturer).
- VOC @100%: 1001 g/L.
- pH (10 g/L): N/A (solvent-based).
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