KYZEN E5631J – Ready-to-Use stencil cleaner for online and offline stencil cleaning

KYZEN E5631J is a pre-mixed stencil cleaner developed for the effective removal of raw solder paste from stencils in both online and offline stencil cleaning processes. The product is supplied ready-to-use and has been developed as a safe and effective alternative to isopropyl alcohol (IPA), traditionally used for understencil cleaning in SMT production.

Using a pre-mixed solution eliminates the need for mixing and handling concentrates. This ensures consistent cleaning quality, reduces the risk of process errors, and makes it easy to implement the product directly into existing stencil cleaning systems.

Ready for direct use in production

KYZEN E5631J is designed for use in automatic understencil systems as well as manual and offline cleaning processes. The product effectively removes all types of raw solder paste and helps ensure stable printing results throughout the production run.

Effective stencil cleaning is crucial for maintaining consistent solder paste deposits, reducing printing errors, and ensuring high quality in the subsequent SMT process.

A safe alternative to IPA

Many electronics manufacturers still use IPA for stencil cleaning, but KYZEN E5631J offers a more modern solution focusing on both operator safety and process performance.

The product is designed to:

• Remove raw solder paste quickly and effectively
• Ensure uniform cleaning of stencil apertures
• Support stable printing processes
• Reduce handling of flammable solvents
• Minimize the risk of errors caused by insufficient stencil cleaning

Documented compatibility

KYZEN E5631J has been tested and documented compatible with commonly used:

• SMT stencils
• Understencil cleaning systems
• Automatic stencil printers
• Printer manufacturers' recommended materials
• Cleaning equipment for SMT production

This makes the product suitable for integration into both existing and new production lines.

• Advantages of KYZEN E5631J
• Pre-mixed and ready-to-use
• Contains approx. 15% active cleaning chemistry
• Effective removal of raw solder paste
• Suitable for online and offline stencil cleaning
• Alternative to traditional IPA cleaning
• Reduces the risk of misprints
• Compatible with common stencils and printers
• Easy implementation without mixing
• Developed with a focus on operator and environment

Recommended process parameters

• Process: Online and offline stencil cleaning
• Concentration: Ready-to-use
• Temperature: Ambient to 49 °C
• Rinsing: DI water or compatible solvent
• Drying: Warm air recommended

Specifications

Manufacturer: KYZEN
Product name: E5631J
Product type: Ready-to-use stencil cleaner
Application: Removal of raw solder paste from stencils
Concentration: Pre-mixed (approx. 15%)
Cleaning method: Online and offline stencil cleaning
Operating temperature: Up to 49 °C
Water solubility: Complete
Boiling point: 100 °C
VOC content: 131 g/L
Drying: Warm air recommended