Product Overview
This desoldering wick from CHEMTRONIC, Soder-Wick No Clean desoldering wick, is a pre-fluxed copper braid designed to remove solder without leaving harmful flux residues. Soder-Wick No Clean is coated with a patented, non-corrosive, halide-free organic no-clean flux and is supplied on ESD-safe spools.Documentation
Technical Data Sheet (TDS) is available from the manufacturer: View data sheet from manufacturer
Typical Applications
Typical applications for Soder-Wick No Clean desoldering wick are indicated by the manufacturer and include:
- Solder removal from lugs and posts
- Solder removal from microcircuits
- Solder removal from Surface Mount Device (SMD) pads
- Solder removal from Ball Grid Array (BGA) pads
Additional Features
Soder-Wick No Clean desoldering wick requires minimal or no post-cleaning, as the flux is no-clean and non-corrosive. ESD-safe spools are offered to reduce the risk of damage from static electricity. The product is available in spools and in resealable packaging options such as 5' and 10' bobbins.
Specifications
- Product name: Soder-Wick No Clean desoldering wick
- Manufacturer: CHEMTRONIC
- Manufacturer's part number: SW60-1-10
- Width: 0.03 in (0.8 mm)
- Length: 10 ft (3.0 m) ESD-safe spool
- Material: Pre-fluxed copper braid
- Flux: Patented, non-corrosive, halide-free organic no-clean flux
- Meets standards: MIL-F-14256F; DOD-STD-883E Method 2022; Bellcore TR-NWT-000078; ANSI/IPC J-STD-004 Type ROL0
- Availability: 5' and 10' bobbins, resealable packaging options (indicated by manufacturer)
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