Tin solder SN100CS® – SnCu0.7NiGe 2.0 mm
SN100CS® from Balver Zinn is an advanced development of the renowned SN100C® alloy, designed for professional soldering processes where high process stability, low oxidation, and consistent solder quality are essential. The alloy combines tin, copper, nickel, and germanium to create a lead-free soldering solution with proven benefits in electronics manufacturing, rework, and industrial soldering.
The increased germanium content helps reduce oxidation during the soldering process, contributing to lower material consumption, less dross formation, and a more stable process over time. The result is excellent solder joints and high quality in the finished production.
Further development of the well-known SN100C® technology
SN100CS® builds on the proven SN100C® alloy, which has been one of the preferred lead-free solder alloys in the electronics industry for many years. With the addition of nickel and an increased germanium content, a more stable alloy is achieved, especially suitable for demanding production environments.
The alloy is developed for companies seeking a lead-free alternative with high operational reliability and consistent results.
Suitable for electronics, cabling, and repair
The robust 2.0 mm wire diameter makes the product suitable for tasks where more solder is needed than in traditional electronics soldering, but where good control over the soldering process is still desired.
Typical applications include:
• Soldering of PCBs and larger components
• Cable and wire connections
• Current-carrying connections
• Repair and maintenance of electronics
• Industrial electronics
• Electrical and energy applications
• Prototypes and special production
The 2.0 mm wire is a popular choice for both workshops and production environments where larger solder points and components with high thermal mass are handled.
Reduces oxidation and dross formation
SN100CS® is developed with a focus on minimizing oxidation during the soldering process. The germanium content helps reduce the formation of oxides, while the alloy's composition supports stable soldering properties and excellent soldering results.
Benefits include:
• Reduced oxidation
• Lower dross formation
• Reduced risk of solder bridges
• Improved through-hole filling
• Excellent and shiny solder joints
• High process stability
Advantages of SN100CS®
• Lead-free solder alloy
• Based on the well-known SN100C® technology
• Increased germanium content reduces oxidation
• Low dross formation
• Reduces the risk of solder bridges
• Improved through-hole filling
• Excellent and consistent solder joints
• Suitable for electronics production and maintenance
• High process stability
• RoHS compliant
Technical specifications
Manufacturer: Balver Zinn
Product name: SN100CS®
Product type: Lead-free solid solder wire
Alloy type: SN100CS®
Composition: SnCu0.7Ni0.05Ge0.025
Wire diameter: 2.0 mm
Lead-free: Yes
Copper content: 0.6-0.7%
Nickel content: 0.04-0.06%
Germanium content: 0.02-0.03%
Liquid form: 227 °C
Solid form: 227 °C
Recommended working temperature: 260-320 °C
ANSI/J-STD-006C: Compliant
DIN EN ISO 9453: Alloy 403
RoHS compliant: Yes