Skip to product information
1 of 1

Solder wire Sn63 Pb37% FG 2,2% REL0 0,3 mm 250g

Solder wire Sn63 Pb37% FG 2,2% REL0 0,3 mm 250g

Balver Zinn

SKU:B6337-03

In stock

View full details

You are not logged in and therefore do not see your prices.

Tin Solder Wire Sn63Pb37 FG 2.2% REL0 0.3 mm 500 g

Sn63Pb37 FG is a professional flux-cored solder wire from Balver Zinn, developed for precision soldering, advanced rework, and electronics production with high demands for accuracy and solder joint quality. The combination of the classic Sn63Pb37 alloy and a REL0-classified flux ensures excellent wetting, uniform solder joints, and maximum control over the soldering process.

The very fine wire diameter of 0.3 mm makes the product particularly suitable for microelectronics, fine pitch components, small SMD components, and other tasks where precise dosing of the solder material is crucial.

Sn63Pb37 – the preferred alloy for precision soldering

Sn63Pb37 is a eutectic solder alloy consisting of 63% tin and 37% lead. With a precise melting point of 183 °C, the alloy transitions directly from solid to liquid without a plastic transition zone.

This offers several significant advantages:

• Fast and controlled solidification
• Low risk of cold solder joints
• Excellent wetting properties
• High process stability
• Beautiful solder joints
• Proven reliability

Therefore, Sn63Pb37 continues to be widely used in electronics repair, development, prototyping, and specialized production environments.

Flux-cored solder wire with 2.2% REL0 flux

The solder wire contains 2.2% flux and is classified as REL0 according to IPC J-STD-004.

The flux system contributes to:

• Effective removal of oxides
• Rapid activation during soldering
• Good flowability
• Uniform solder joints
• Minimal residue after soldering
• Stable soldering process

This makes the product ideal for precision work where even small variations can affect the result.

Ideal for microelectronics and advanced rework

The fine 0.3 mm diameter provides maximum control over the amount of solder and makes the product particularly suitable for:

• Microelectronics
• Fine pitch components
• SMD soldering
• BGA rework
• PCB repair
• Prototypes and development projects
• Instrumentation and measurement equipment
• Medical electronics
• Telecommunications

The thin wire allows for precise work on even very small solder points without the risk of over-dosing the solder material.

High solder quality and beautiful solder appearance

Sn63Pb37 is known for providing shiny and uniform solder joints with high mechanical strength.

The advantages include:

• Shiny solder points
• Excellent wetting
• High reproducibility
• Low risk of soldering defects
• Stable soldering process
• Professional solder joint appearance

This makes the product popular among electronics manufacturers, repair shops, and development departments.

Advantages of Sn63Pb37 FG

• Classic eutectic Sn63Pb37 alloy
• Flux content 2.2%
• REL0-classified flux
• Excellent wetting properties
• Suitable for microelectronics and SMD soldering
• Ideal for fine pitch components
• Shiny solder joints
• High process stability
• Maximum precision with 0.3 mm wire
• Proven reliability

Technical Specifications

Manufacturer: Balver Zinn
Product name: Sn63Pb37 FG
Product type: Flux-cored solder wire
Alloy: Sn63Pb37
Composition: 63% tin / 37% lead
Flux content: 2.2%
Flux classification: REL0
Wire diameter: 0.3 mm
Spool weight: 500 g
Melting point: 183 °C
Application: Hand soldering, microelectronics, rework and electronics service
Lead-containing: Yes
Production standard: WBZ BaTiLoy
DIN EN ISO 9453: Alloy 102